US
China
Taiwan
Europe
Other
Equipment
45%
20%
34%
Materials (nonwafer)
28%
30%
40%
Materials (wafer)
20%
14%
65%
IP/electronic design automation
63%
19%
17%
Fabless
58%
16%
18%
4%
4%
Integrated device manufacturers
47%
10%
40%
Pure-play foundry
11%
11%
71%
3%
4%
Assembly, testing and services
11%
15%
49%
25%